DocumentCode :
3512443
Title :
Rapid resin mold with embedded thin film pressure/temperature sensors
Author :
Luo, R.C. ; Lin, C.F. ; Chen, C.M. ; Chen, Y.S.
Author_Institution :
Dept. of Electr. Eng., Nat. Chung Cheng Univ., Chia Yi, Taiwan
Volume :
3
fYear :
1999
fDate :
1999
Firstpage :
1301
Abstract :
In this paper we have developed a new approach by embedding sensors into rapid resin mold´s core and cavity for directly measuring the pressure and temperature information for the purpose of improving the injection molding process. Using the information collected by embedded piezoelectric sensors, we can develop an on-line, close-loop control system to ensure the quality of products. We have simulated the system with time versus temperature for different mold materials
Keywords :
closed loop systems; electric sensing devices; moulding; piezoelectric thin films; piezoelectric transducers; pressure measurement; pressure sensors; process control; temperature measurement; temperature sensors; thin film devices; embedded thin film sensors; injection molding process; on-line close-loop control system; piezoelectric sensors; pressure measurement; product quality control; rapid resin mold; temperature measurement; thin film pressure sensors; thin film temperature sensors; Injection molding; Piezoelectric films; Pressure measurement; Process control; Resins; Sensor phenomena and characterization; Sputtering; Temperature sensors; Thermal sensors; Thin film sensors;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Industrial Electronics Society, 1999. IECON '99 Proceedings. The 25th Annual Conference of the IEEE
Conference_Location :
San Jose, CA
Print_ISBN :
0-7803-5735-3
Type :
conf
DOI :
10.1109/IECON.1999.819399
Filename :
819399
Link To Document :
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