DocumentCode
3512553
Title
Impact of pad de-embedding on the extraction of interconnect parameters
Author
Han, Sangwook ; Kim, Jooyong ; Neikirk, Dean P.
Author_Institution
Dept. of Electr. & Comput. Eng., Texas Univ., Austin, TX, USA
fYear
2006
fDate
6-9 March 2006
Firstpage
76
Lastpage
81
Abstract
In this paper we present measurements of Cu interconnect lines using RF measurements up to 40GHz and discuss the impact of inductive discontinuities on the extraction of interconnect parameters. From measured S-parameters the extracted RLCG for Cu transmission line are found via a de-embedding technique that includes inductive discontinuities due to probe tip-to-pad and interconnect-to-probe pad discontinuities. We show the importance of the probe landing position and the network model of pad for extracting interconnect parameters from RF measurement via experiments of different probe position at frequencies above about 20GHz.
Keywords
S-parameters; copper; integrated circuit interconnections; integrated circuit measurement; microwave integrated circuits; microwave measurement; transmission lines; Cu transmission line; RF measurement; S-parameters; inductive discontinuities; interconnect parameter extraction; interconnect-to-probe pad discontinuities; pad deembedding; probe landing position; probe tip-to-pad discontinuities; Atherosclerosis; Copper; Integrated circuit interconnections; LAN interconnection; Probes; Radio frequency; Scattering parameters; Testing; Transmission line discontinuities; Transmission line measurements;
fLanguage
English
Publisher
ieee
Conference_Titel
Microelectronic Test Structures, 2006. ICMTS 2006. IEEE International Conference on
Print_ISBN
1-4244-0167-4
Type
conf
DOI
10.1109/ICMTS.2006.1614279
Filename
1614279
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