Title :
Impact of pad de-embedding on the extraction of interconnect parameters
Author :
Han, Sangwook ; Kim, Jooyong ; Neikirk, Dean P.
Author_Institution :
Dept. of Electr. & Comput. Eng., Texas Univ., Austin, TX, USA
Abstract :
In this paper we present measurements of Cu interconnect lines using RF measurements up to 40GHz and discuss the impact of inductive discontinuities on the extraction of interconnect parameters. From measured S-parameters the extracted RLCG for Cu transmission line are found via a de-embedding technique that includes inductive discontinuities due to probe tip-to-pad and interconnect-to-probe pad discontinuities. We show the importance of the probe landing position and the network model of pad for extracting interconnect parameters from RF measurement via experiments of different probe position at frequencies above about 20GHz.
Keywords :
S-parameters; copper; integrated circuit interconnections; integrated circuit measurement; microwave integrated circuits; microwave measurement; transmission lines; Cu transmission line; RF measurement; S-parameters; inductive discontinuities; interconnect parameter extraction; interconnect-to-probe pad discontinuities; pad deembedding; probe landing position; probe tip-to-pad discontinuities; Atherosclerosis; Copper; Integrated circuit interconnections; LAN interconnection; Probes; Radio frequency; Scattering parameters; Testing; Transmission line discontinuities; Transmission line measurements;
Conference_Titel :
Microelectronic Test Structures, 2006. ICMTS 2006. IEEE International Conference on
Print_ISBN :
1-4244-0167-4
DOI :
10.1109/ICMTS.2006.1614279