DocumentCode :
3513853
Title :
Study of reliability integrated assessment method based on performance, environmental and reliability tests for electronic products
Author :
Wan, Bo ; Zhuang, Xiaotiang
Author_Institution :
Dept. of Syst. Eng., Beihang Univ., Beijing, China
fYear :
2009
fDate :
20-24 July 2009
Firstpage :
437
Lastpage :
441
Abstract :
The paper constructs the multi-regress-analysis reliability assessment method based on the exponential regression model due to the possible fewer samples for testing in electronic products reliability assessment. By introducing environmental severe degree factors, environmental integrated factors and technique states of the product factors, the multi-regress-analysis reliability assessment method is established and product reliability assessment is implemented based on performance test data, environmental test data, and reliability test data. When using this method, the time data does not need to be converted under different environment, and the regression parameters will be calculated to give the pertinent reliability parameters, which is quite different from the classic environmental-changing and maternal-changing reliability integrated assessment method.
Keywords :
electronic equipment testing; electronic products; environmental testing; equipment evaluation; regression analysis; reliability; environmental changing reliability; environmental reliability test; exponential regression model; maternal changing reliability; multiregress analysis reliability assessment method; performance reliability test; product reliability assessment; reliability integrated assessment method; Data engineering; Electronic equipment testing; Electronic mail; Environmental factors; Hazards; Product development; Reliability engineering; Stress; System testing; Systems engineering and theory; exponential regression model; integrated assessment; reliability;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Reliability, Maintainability and Safety, 2009. ICRMS 2009. 8th International Conference on
Conference_Location :
Chengdu
Print_ISBN :
978-1-4244-4903-3
Electronic_ISBN :
978-1-4244-4905-7
Type :
conf
DOI :
10.1109/ICRMS.2009.5270155
Filename :
5270155
Link To Document :
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