DocumentCode :
3513951
Title :
Power module and cooling system thermal performance evaluation for HEV application
Author :
Ning, Puqi ; Liang, Zhenxian ; Wang, Fred ; Marlino, Laura
Author_Institution :
Nat. Transp. Res. Center, Oak Ridge Nat. Lab., Knoxville, TN, USA
fYear :
2012
fDate :
5-9 Feb. 2012
Firstpage :
2134
Lastpage :
2139
Abstract :
To further reduce system costs and package volumes of hybrid electric vehicles (HEVs), it is important to optimize the power module and associated cooling system. This paper reports the thermal performance evaluation and analysis of three commercial power modules with different cooling systems. Experiments and simulations were conducted to help further optimization of design. Results show that power electronics can be better merged with the mechanical environment.
Keywords :
automotive electronics; cooling; hybrid electric vehicles; modules; power supply circuits; thermal management (packaging); HEV application; cooling system thermal performance evaluation; hybrid electric vehicle; package volume; power electronics; power module; Cooling; Insulated gate bipolar transistors; Multichip modules; Temperature measurement; Temperature sensors; Thermal resistance;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Applied Power Electronics Conference and Exposition (APEC), 2012 Twenty-Seventh Annual IEEE
Conference_Location :
Orlando, FL
Print_ISBN :
978-1-4577-1215-9
Electronic_ISBN :
978-1-4577-1214-2
Type :
conf
DOI :
10.1109/APEC.2012.6166116
Filename :
6166116
Link To Document :
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