• DocumentCode
    3513951
  • Title

    Power module and cooling system thermal performance evaluation for HEV application

  • Author

    Ning, Puqi ; Liang, Zhenxian ; Wang, Fred ; Marlino, Laura

  • Author_Institution
    Nat. Transp. Res. Center, Oak Ridge Nat. Lab., Knoxville, TN, USA
  • fYear
    2012
  • fDate
    5-9 Feb. 2012
  • Firstpage
    2134
  • Lastpage
    2139
  • Abstract
    To further reduce system costs and package volumes of hybrid electric vehicles (HEVs), it is important to optimize the power module and associated cooling system. This paper reports the thermal performance evaluation and analysis of three commercial power modules with different cooling systems. Experiments and simulations were conducted to help further optimization of design. Results show that power electronics can be better merged with the mechanical environment.
  • Keywords
    automotive electronics; cooling; hybrid electric vehicles; modules; power supply circuits; thermal management (packaging); HEV application; cooling system thermal performance evaluation; hybrid electric vehicle; package volume; power electronics; power module; Cooling; Insulated gate bipolar transistors; Multichip modules; Temperature measurement; Temperature sensors; Thermal resistance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Applied Power Electronics Conference and Exposition (APEC), 2012 Twenty-Seventh Annual IEEE
  • Conference_Location
    Orlando, FL
  • Print_ISBN
    978-1-4577-1215-9
  • Electronic_ISBN
    978-1-4577-1214-2
  • Type

    conf

  • DOI
    10.1109/APEC.2012.6166116
  • Filename
    6166116