DocumentCode
3513951
Title
Power module and cooling system thermal performance evaluation for HEV application
Author
Ning, Puqi ; Liang, Zhenxian ; Wang, Fred ; Marlino, Laura
Author_Institution
Nat. Transp. Res. Center, Oak Ridge Nat. Lab., Knoxville, TN, USA
fYear
2012
fDate
5-9 Feb. 2012
Firstpage
2134
Lastpage
2139
Abstract
To further reduce system costs and package volumes of hybrid electric vehicles (HEVs), it is important to optimize the power module and associated cooling system. This paper reports the thermal performance evaluation and analysis of three commercial power modules with different cooling systems. Experiments and simulations were conducted to help further optimization of design. Results show that power electronics can be better merged with the mechanical environment.
Keywords
automotive electronics; cooling; hybrid electric vehicles; modules; power supply circuits; thermal management (packaging); HEV application; cooling system thermal performance evaluation; hybrid electric vehicle; package volume; power electronics; power module; Cooling; Insulated gate bipolar transistors; Multichip modules; Temperature measurement; Temperature sensors; Thermal resistance;
fLanguage
English
Publisher
ieee
Conference_Titel
Applied Power Electronics Conference and Exposition (APEC), 2012 Twenty-Seventh Annual IEEE
Conference_Location
Orlando, FL
Print_ISBN
978-1-4577-1215-9
Electronic_ISBN
978-1-4577-1214-2
Type
conf
DOI
10.1109/APEC.2012.6166116
Filename
6166116
Link To Document