DocumentCode
3514154
Title
Success ratio sequential test plan using development test data
Author
Li, Jin ; Shen, Lijuan ; Zhao, Lei
Author_Institution
Dept. of Syst. Eng., Beihang Univ., Beijing, China
fYear
2009
fDate
20-24 July 2009
Firstpage
370
Lastpage
373
Abstract
Success ratio sequential sampling plan is a common test plan for reliability compliance test. The standard sampling inspection used in practical project for reliability compliance test is difficult for application due to the cost and total sample size, especially for complex systems. While the test data acquired in product development phase is abundant. Thus using these data in reliability compliance test can reduce sample size and cost. This paper adopted a method called success ratio sequential sampling plan, which transformed the data acquired in product development phase to the equivalent actual data using ldquosimilarity coefficientrdquo, and integrated the equivalent actual data to the real compliance test data using Bayesian statistical formula. A simulation revealed that the data acquired in product development phase could be effectively used and the sequential compliance test sample size could be reduced compared with the traditional compliance test.
Keywords
Bayes methods; conformance testing; inspection; large-scale systems; maintenance engineering; product development; reliability; sampling methods; Bayesian statistical formula; complex system; maintenance engineering; product development test data; reliability compliance test; similarity coefficient; standard sampling inspection; success ratio sequential sampling plan; success ratio sequential test plan; Bayesian methods; Costs; Data engineering; Inspection; Product development; Reliability engineering; Sampling methods; Sequential analysis; System testing; Systems engineering and theory; Development test data; Reliability compliance test; Sequential test; Success ratio;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability, Maintainability and Safety, 2009. ICRMS 2009. 8th International Conference on
Conference_Location
Chengdu
Print_ISBN
978-1-4244-4903-3
Electronic_ISBN
978-1-4244-4905-7
Type
conf
DOI
10.1109/ICRMS.2009.5270171
Filename
5270171
Link To Document