• DocumentCode
    3514175
  • Title

    Half-bridge resonant inverter for domestic induction heating based on silicon carbide technology

  • Author

    Bernal, C. ; Gaudó, P. Molina ; Gállego, A. ; Otín, A. ; Burdío, J.M.

  • Author_Institution
    I3A - Inst. de Investig. en Ing. de Aragon, Univ. of Zaragoza, Zaragoza, Spain
  • fYear
    2012
  • fDate
    5-9 Feb. 2012
  • Firstpage
    2218
  • Lastpage
    2222
  • Abstract
    This paper presents a half-bridge SiC resonant inverter applied to induction heating for domestic appliances. The main objective of this work is to evaluate a SiC normally-ON VJFET as this device is commercially available. Two different references of this nO-JFET have been tested. This design is focused in the extension of the usable frequency range and efficiency over the parameters typically achieved in traditional Si-IGBT domestic induction heating inverters. The paper describes the design methodology to obtain the optimal switching conditions at higher frequency limits, considering SiC technology. Fundamental aspects to be taken into account are switching losses, the choice and convenience of snubber capacitors and the driver design. Comparative results for output power delivered to an induction heating coil and load are presented, verifying the advantages of SiC technology in improved efficiency at low output power range.
  • Keywords
    domestic appliances; induction heating; insulated gate bipolar transistors; junction gate field effect transistors; resonant invertors; silicon compounds; IGBT; SiC; domestic appliances; driver design; half-bridge resonant inverter; induction heating coil; induction heating load; low output power range; normally-ON VJFET; optimal switching conditions; snubber capacitors; switching losses; usable frequency range; Electromagnetic heating; Inverters; JFETs; Logic gates; Power generation; Silicon carbide; Snubbers;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Applied Power Electronics Conference and Exposition (APEC), 2012 Twenty-Seventh Annual IEEE
  • Conference_Location
    Orlando, FL
  • Print_ISBN
    978-1-4577-1215-9
  • Electronic_ISBN
    978-1-4577-1214-2
  • Type

    conf

  • DOI
    10.1109/APEC.2012.6166130
  • Filename
    6166130