DocumentCode :
3514554
Title :
Survivability of Flip Chips Using PCBs with Carbon Fiber in a Fatigue Environment
Author :
Tudryn, Carissa D.
Author_Institution :
Jet Propulsion Lab., California Inst. of Technol., Pasadena, CA
fYear :
2008
fDate :
1-8 March 2008
Firstpage :
1
Lastpage :
6
Abstract :
Flip chip packaging technology is being developed using printed circuit boards (PCBs) with carbon fiber composites or STABLCORreg, to withstand low temperature, fatigue conditions on Mars, from -130degC to +85degC, for a 1 year mission. This technology will benefit future rovers by allowing for electronic packaging to be incorporated as highly dense, low mass multifunctional structures outside a warm electronics box (WEB). STABLCORreg is fabricated within the PCB in proximity to the flip chips. The flip chips on boards with and without carbon fiber weave failed due to thermal strain and, ultimately, fatigue. It was also found that the carbon fiber weave within the board affects the flatness and, ultimately, the survivability of flip chips. Further experiments must be performed in order to fully determine if STABCLORreg increases the flip chip survivability in this extreme environment. This paper describes the design, assembly, and testing of flip chips in this extreme environment, and additional experiments needed for the flip chip packaging on boards with and without STABLCORreg.
Keywords :
carbon fibre reinforced composites; circuit reliability; electronics packaging; flip-chip devices; planetary rovers; printed circuits; PCB; STABLCOR; carbon fiber composites; electronic packaging; fatigue environment; flip chip packaging technology; flip chip survivability; printed circuit boards; temperature -130 C to 85 C; time 1 year; warm electronics box; Assembly; Capacitive sensors; Electronic packaging thermal management; Electronics packaging; Fatigue; Flip chip; Mars; Optical fiber testing; Printed circuits; Temperature;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Aerospace Conference, 2008 IEEE
Conference_Location :
Big Sky, MT
ISSN :
1095-323X
Print_ISBN :
978-1-4244-1487-1
Electronic_ISBN :
1095-323X
Type :
conf
DOI :
10.1109/AERO.2008.4526479
Filename :
4526479
Link To Document :
بازگشت