• DocumentCode
    3514677
  • Title

    Silicon-Germanium as an Enabling IC Technology for Extreme Environment Electronics

  • Author

    Cressler, John D.

  • Author_Institution
    Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA
  • fYear
    2008
  • fDate
    1-8 March 2008
  • Firstpage
    1
  • Lastpage
    7
  • Abstract
    Extreme environments" represents an important niche venue for electronic components, and spans the operation of electronics in surroundings lying outside the domain of conventional commercial and military specifications. Such extreme environments would include, for instance, operation down to very low temperatures (e.g., to 77 K or even 4.2 K), 2) operation up to very high temperatures (e.g., to 200degC or even 300degC), 3) operation across very wide and cyclic temperature swings, and 4) operation in a radiation-rich environment (e.g., space), or even all four simultaneously. We have previously argued that the unique bandgap-engineered features of SiGe HBTs offer great utility to simultaneously satisfy all four of these extreme environment domains, potentially with little or no process modification, ultimately providing compelling advantages at the IC and system level, across a wide class of commercial and defense applications. In the present work, we detail the application of SiGe technology for building electronic components of interest to NASA and the space community for operation in one of the "classic" extreme environments - on the lunar surface.
  • Keywords
    Ge-Si alloys; cryogenic electronics; heterojunction bipolar transistors; high-temperature electronics; space vehicle electronics; Ge-Si; HBT; IC technology; NASA; extreme environment electronics; lunar surface; radiation-rich environment; very high temperatures; very low temperatures; BiCMOS integrated circuits; Electronic components; Electronic packaging thermal management; Germanium silicon alloys; Military computing; Moon; NASA; Silicon germanium; Space technology; Temperature;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Aerospace Conference, 2008 IEEE
  • Conference_Location
    Big Sky, MT
  • ISSN
    1095-323X
  • Print_ISBN
    978-1-4244-1487-1
  • Electronic_ISBN
    1095-323X
  • Type

    conf

  • DOI
    10.1109/AERO.2008.4526489
  • Filename
    4526489