Title :
Ultra-Wide Temperature (-230°C to 130°C) DC-Motor Drive with SiGe Asynchronous Controller
Author :
Bourne, Jack ; Schupbach, Roberto ; Hollosi, Brent ; Di, Jia ; Lostetter, Alexander ; Mantooth, H. Alan
Author_Institution :
Arkansas Power Electron. Int., Inc., Fayetteville, AR
Abstract :
Spacecraft routinely experience extreme environmental conditions, including cryogenic (as low as -230degC) and elevated temperatures (as high as +130degC). Presently, the temperature of the spacecraft electronics is regulated to its safe operating temperature. The need for temperature regulation on current spacecrafts imposes significant constraints on spacecraft design and also limits performance. This paper details efforts to develop a DC motor drive operational in extreme ambient temperatures (-230 to +130degC). The circuitry of this motor drive is to be based on mature, commercially available technologies and a custom silicon germanium (SiGe) low power asynchronous 8051-pin-compatible microprocessor ASIC. In this paper, the authors present results of passive and active commercial component testing carried out to date, a discussion of the developed automated asynchronous logic design flow, and a discussion of ultra-wide temperature range NULL Convention Logic (NCLtrade) IC design work accomplished to date. Developments made during this research project will allow for a more rapid and more reliable circuit design of ultra-wide range or cryogenic electronics, particularly NCL circuits and power electronic circuits.
Keywords :
DC motor drives; Ge-Si alloys; application specific integrated circuits; cryogenic electronics; integrated circuit design; machine control; DC-motor drive; SiGe; active commercial component testing; asynchronous controller; automated asynchronous logic design flow; cryogenic; low power asynchronous compatible microprocessor ASIC; silicon germanium; spacecraft electronics; temperature -230 degC to 130 degC; temperature regulation; Aerospace electronics; Circuits; Cryogenics; DC motors; Germanium silicon alloys; Logic design; Logic testing; Silicon germanium; Space vehicles; Temperature control;
Conference_Titel :
Aerospace Conference, 2008 IEEE
Conference_Location :
Big Sky, MT
Print_ISBN :
978-1-4244-1487-1
Electronic_ISBN :
1095-323X
DOI :
10.1109/AERO.2008.4526490