DocumentCode
3514930
Title
Multi-chip SiC DMOSFET half-bridge power module for high temperature operation
Author
Funaki, Tsuyoshi ; Sasagawa, Masashi ; Nakamura, Takashi
Author_Institution
Div. Electr., Electron. & Inf. Eng., Osaka Univ., Suita, Japan
fYear
2012
fDate
5-9 Feb. 2012
Firstpage
2525
Lastpage
2529
Abstract
The authors developed 80A, 1200V half bridge SiC power module for high temperature operation with connecting multiple small current rating SiC MOSFETs in parallel on a ceramic substrate. This paper characterizes and evaluates the static characteristics and switching operation capability of the developed power module from room temperature (25C) to high temperature condition (200C). First, the static current-voltage characteristics for wide temperature range are tested, and then terminal capacitance-voltage characteristics are evaluated. The switching behavior of the SiC power module is experimented and the temperature dependencies are evaluated. The results clarified the high temperature operation capability of the developed SiC power module without degrading fast switching capability.
Keywords
MOSFET circuits; ceramics; multichip modules; power integrated circuits; silicon compounds; wide band gap semiconductors; SiC; ceramic substrate; current 80 A; fast switching capability; high temperature operation; multichip DMOSFET half-bridge power module; static characteristics; static current-voltage characteristics; switching behavior; switching operation capability; temperature 25 C to 200 C; terminal capacitance-voltage characteristics; voltage 1200 V; Logic gates; MOSFET circuits; Multichip modules; Silicon carbide; Temperature; Temperature measurement; Threshold voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Applied Power Electronics Conference and Exposition (APEC), 2012 Twenty-Seventh Annual IEEE
Conference_Location
Orlando, FL
Print_ISBN
978-1-4577-1215-9
Electronic_ISBN
978-1-4577-1214-2
Type
conf
DOI
10.1109/APEC.2012.6166178
Filename
6166178
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