DocumentCode
3515084
Title
A mobile WiMAX RF front-end module with integrated passive components and novel material
Author
Chen, Wei-Ting ; Chen, Chang-Sheng ; Tsai, Cheng-Hua ; Chin, Kuo-Chiang ; Lai, Shinn-Juh
Author_Institution
Electron. & Opto-Electron. Res. Labs., Ind. Technol. Res. Inst., Hsinchu
fYear
2008
fDate
1-4 Sept. 2008
Firstpage
181
Lastpage
186
Abstract
System in package (SiP) plays an important role in the mobile communication market, while it can efficiently improve the size shrinkage, cost-effectiveness and available time of the products. Good achievements have been realized by other works in the past years, such as VCO, PA, BPF, Balun, Bluetooth module, and Wi-Fi systems with embedded passives [1-4]. Nowadays, the current trend is towards personal multi-media applications requiring high transmission data rate and mobility. Therefore, worldwide interoperability for microwave access (WiMAX) communication system is developed to meet the requirements. In this system, the operation of the wide channel bandwidth and the linearity of signals are the critical issue, especially in the circuit designs. This paper describes the design methodology of a RF front-end module with the modelling of embedded passive components that integrates with the power amplifier (PA), RF switch, BPF, and LPF circuit and operates over 2.3 - 2.7 GHz mobile WiMAX system. Additionally, the novel high-permittivity organic material with DK~20.8 at 2.4 GHz was also been developed. It minimizes circuit areas, greatly increases the quality factor of passive components and can be compatible with traditional PCB lamination process to reduce the production cost. By this material and multi-layers substrates realized by PCB process, the embedded passives largely replace SMDs including the inductors, capacitors, and filter components. The final designed embedded RF front-end produces 23 dB gain, better than 10 dB return loss in the TX path; and 2.5 dB noise figure with greater than 11 dB return loss in the RX path. Through the embedded technologies, 10 capacitors, 5 inductors, and 2 filters were embedded into the substrate, occupying almost 70.8 % of the total passive components, and the size of embedded front-end is less than 600 times 600 mil2. These technical results not only promote the technology of SiP but provide the solutions for the br- - oadband mobile communication applications.
Keywords
WiMax; integrated circuit design; mobile communication; system-in-package; embedded RF front-end; integrated passive components; mobile WiMAX RF front-end module; mobile communication market; system in package; Band pass filters; Capacitors; Circuits; Inductors; Mobile communication; Packaging; Radio frequency; Switches; Voltage-controlled oscillators; WiMAX;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics System-Integration Technology Conference, 2008. ESTC 2008. 2nd
Conference_Location
Greenwich
Print_ISBN
978-1-4244-2813-7
Electronic_ISBN
978-1-4244-2814-4
Type
conf
DOI
10.1109/ESTC.2008.4684346
Filename
4684346
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