DocumentCode
3515191
Title
A systematic design approach to thermal-electrical power electronics integration
Author
Cottet, Didier ; Drofenik, Uwe ; Meyer, Jean-Marc
Author_Institution
Corp. Res., ABB Switzerland Ltd., Baden-Dattwil
fYear
2008
fDate
1-4 Sept. 2008
Firstpage
219
Lastpage
224
Abstract
With the growing demand for integration density of power electronic systems, efficient multi-domain simulations are becoming indispensable design tools. This paper therefore presents a systematic simulation approach for coupled thermal-electrical design of power modules and systems. The presented solution is based on coupled thermal-electrical equivalent circuits and consists of optimized algorithms for accelerating the simulations by orders of magnitude, while keeping the required accuracy. With this type of simulation, load cycles for complete mission profiles can be computed and used for thermal management, reliability and lifetime estimations of power electronic systems.
Keywords
power electronics; thermal management (packaging); thermoelectric devices; thermoelectric power; coupled thermal-electrical equivalent circuits; lifetime estimations; power electronic systems; power modules; reliability; thermal management; thermal-electrical power electronics integration; Acceleration; Circuit simulation; Computational modeling; Coupling circuits; Equivalent circuits; Multichip modules; Power electronics; Power system reliability; Thermal loading; Thermal management of electronics;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics System-Integration Technology Conference, 2008. ESTC 2008. 2nd
Conference_Location
Greenwich
Print_ISBN
978-1-4244-2813-7
Electronic_ISBN
978-1-4244-2814-4
Type
conf
DOI
10.1109/ESTC.2008.4684353
Filename
4684353
Link To Document