• DocumentCode
    3515191
  • Title

    A systematic design approach to thermal-electrical power electronics integration

  • Author

    Cottet, Didier ; Drofenik, Uwe ; Meyer, Jean-Marc

  • Author_Institution
    Corp. Res., ABB Switzerland Ltd., Baden-Dattwil
  • fYear
    2008
  • fDate
    1-4 Sept. 2008
  • Firstpage
    219
  • Lastpage
    224
  • Abstract
    With the growing demand for integration density of power electronic systems, efficient multi-domain simulations are becoming indispensable design tools. This paper therefore presents a systematic simulation approach for coupled thermal-electrical design of power modules and systems. The presented solution is based on coupled thermal-electrical equivalent circuits and consists of optimized algorithms for accelerating the simulations by orders of magnitude, while keeping the required accuracy. With this type of simulation, load cycles for complete mission profiles can be computed and used for thermal management, reliability and lifetime estimations of power electronic systems.
  • Keywords
    power electronics; thermal management (packaging); thermoelectric devices; thermoelectric power; coupled thermal-electrical equivalent circuits; lifetime estimations; power electronic systems; power modules; reliability; thermal management; thermal-electrical power electronics integration; Acceleration; Circuit simulation; Computational modeling; Coupling circuits; Equivalent circuits; Multichip modules; Power electronics; Power system reliability; Thermal loading; Thermal management of electronics;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics System-Integration Technology Conference, 2008. ESTC 2008. 2nd
  • Conference_Location
    Greenwich
  • Print_ISBN
    978-1-4244-2813-7
  • Electronic_ISBN
    978-1-4244-2814-4
  • Type

    conf

  • DOI
    10.1109/ESTC.2008.4684353
  • Filename
    4684353