DocumentCode :
3515238
Title :
Investigation of thick film electronic packaging materials in dynamic contact with artificial body fluids
Author :
Beshchasna, N. ; Engelien, E. ; Uhlemann, J. ; Wolter, K. -J
Author_Institution :
Dept. of Electr. Eng. & Inf. Technol., Tech. Univ. Dresden, Dresden
fYear :
2008
fDate :
1-4 Sept. 2008
Firstpage :
253
Lastpage :
258
Abstract :
Thick film electronic packaging materials based on Ag-Pt (C4729), Ag-Pd (C2030) and Pt (LPA 88-11) conductive pastes were tested on their properties under the influence of flowing artificial blood plasma (ABP), artificial cerebrospinal fluid (ACF) and physiological solution (0.9% NaCl) for the evaluation of their biostability grade in vitro. The degradation effects were studied by means of microscopic investigations, measurements of a surface free energy, determination of mass losses and analysis of a chemical content. Materials were stressed in fluid mediums during the periods of up to 60 days at the temperature of 60degC, pH value of (8-10) and flow velocity of 0.15 m/s in systems with a directional flow and by an unidirectional fluid circulation. Based on SEM-EDX analysis, formation of silver sulphide (Ag2S) in form of yellow-brown precipitate has been observed on Ag-Pt surfaces, which were influenced by ABP and ACF; a partly dissolution of Zn and Na particles from pastes glass matrix was supposed. No significant alterations in chemical content were revealed in case of interactions between Ag-Pt thick films and 0.9% NaCl. Ag-Pd surfaces were more stable due to formation of the protection palladium oxide (PdO) film. A very good stability have shown Pt-layers.
Keywords :
biomedical electronics; electronics packaging; prosthetics; artificial blood plasma; artificial body fluids; artificial cerebrospinal fluid; biostability grade in vitro; dynamic contact; physiological solution; thick film electronic packaging materials; Biological materials; Blood; Chemical analysis; Conducting materials; Electronic equipment testing; Electronics packaging; Fluid dynamics; Materials testing; Plasma properties; Thick films;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics System-Integration Technology Conference, 2008. ESTC 2008. 2nd
Conference_Location :
Greenwich
Print_ISBN :
978-1-4244-2813-7
Electronic_ISBN :
978-1-4244-2814-4
Type :
conf
DOI :
10.1109/ESTC.2008.4684358
Filename :
4684358
Link To Document :
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