Title :
Property evaluations of polymers used as housing material for passivation of electronic devices
Author :
Engelien, E. ; Beshchasna, N. ; Braunschweig, M. ; Uhlemann, J. ; Wolter, K.-J.
Author_Institution :
Dept. of Electr. Eng. & Inf. Technol., Tech. Univ. Dresden, Dresden
Abstract :
In electronics, and especially in medicine technology, the significance of polymers rises at the present time. According to various publications about properties of polymers from different manufacturers, polymers have good dielectric properties, high conformity of coating, low permeability and high stability. Consequently, polymers are a good choice for many different applications. They allow flexible passivation for protection against harmful substances from dust to molecules in liquids. In this context the determination of the diffusion coefficient allows important insight into the protection performance of different polymers. At the example of a 1% NaCl-solution the permeability of different housing materials was measured as a parameter of their protection performance. These tests were broadened by experiments of the optic and geometric surface properties and the determination of the materialspsila adhesion forces. As housing polymers of electronic devices were examined a non-elastic and a flexible solder resist, a sealing wax, a sole gel as well as a Chlor-Poly-Para-Xylylen.
Keywords :
electronics packaging; passivation; polymer films; polymers; diffusion coefficient; electronic devices passivation; housing material; polymers; Coatings; Dielectric materials; Liquids; Manufacturing; Optical materials; Passivation; Permeability; Polymer films; Protection; Stability;
Conference_Titel :
Electronics System-Integration Technology Conference, 2008. ESTC 2008. 2nd
Conference_Location :
Greenwich
Print_ISBN :
978-1-4244-2813-7
Electronic_ISBN :
978-1-4244-2814-4
DOI :
10.1109/ESTC.2008.4684359