• DocumentCode
    3515252
  • Title

    Property evaluations of polymers used as housing material for passivation of electronic devices

  • Author

    Engelien, E. ; Beshchasna, N. ; Braunschweig, M. ; Uhlemann, J. ; Wolter, K.-J.

  • Author_Institution
    Dept. of Electr. Eng. & Inf. Technol., Tech. Univ. Dresden, Dresden
  • fYear
    2008
  • fDate
    1-4 Sept. 2008
  • Firstpage
    259
  • Lastpage
    264
  • Abstract
    In electronics, and especially in medicine technology, the significance of polymers rises at the present time. According to various publications about properties of polymers from different manufacturers, polymers have good dielectric properties, high conformity of coating, low permeability and high stability. Consequently, polymers are a good choice for many different applications. They allow flexible passivation for protection against harmful substances from dust to molecules in liquids. In this context the determination of the diffusion coefficient allows important insight into the protection performance of different polymers. At the example of a 1% NaCl-solution the permeability of different housing materials was measured as a parameter of their protection performance. These tests were broadened by experiments of the optic and geometric surface properties and the determination of the materialspsila adhesion forces. As housing polymers of electronic devices were examined a non-elastic and a flexible solder resist, a sealing wax, a sole gel as well as a Chlor-Poly-Para-Xylylen.
  • Keywords
    electronics packaging; passivation; polymer films; polymers; diffusion coefficient; electronic devices passivation; housing material; polymers; Coatings; Dielectric materials; Liquids; Manufacturing; Optical materials; Passivation; Permeability; Polymer films; Protection; Stability;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics System-Integration Technology Conference, 2008. ESTC 2008. 2nd
  • Conference_Location
    Greenwich
  • Print_ISBN
    978-1-4244-2813-7
  • Electronic_ISBN
    978-1-4244-2814-4
  • Type

    conf

  • DOI
    10.1109/ESTC.2008.4684359
  • Filename
    4684359