Micro ribbon cable bonding for an implantable device

Assembly and encapsulation is in many cases a restriction for miniaturizing microsystems. For implantable devices with a signal cable attached this is even more critical. This paper introduces assembly methods for a micro ribbon cable, focusing on insulation removal and cable-substrate bonding. Two different methods for stripping the cable are presented; the use of femto second laser and by plasma etching. Similarly, two methods for cable-substrate bonding are presented; wedge bonding and non-conductive adhesive bonding. The presented methods will significantly reduce the size for implantable devices where cable attachment is required.