DocumentCode
3515409
Title
Assembly of ultra-thin chip packages (UTCPs) for enhanced flexibility of flexible displays
Author
Govaerts, Jonathan ; Vanfleteren, Jan
Author_Institution
CMST - UGent / IMEC, Zwijnaarde
fYear
2008
fDate
1-4 Sept. 2008
Firstpage
309
Lastpage
314
Abstract
In this paper, a setup has been designed to test the assembly of UTCPs onto patterned flexible substrates. The assembly is carried out with Anisotropic Conductive Film (ACF) bonding, offering the advantages of fine pitch connection possibilities and low-temperature curing, often a requirement for flexible display backplanes. Furthermore, the UTCP has been designed with contacts at the four sides of the (square) package, and a matching thermode allows for all four sides to be bonded at the same time.
Keywords
chip scale packaging; conducting materials; curing; fine-pitch technology; flexible displays; microassembling; anisotropic conductive film bonding; flexible displays; low-temperature curing; matching thermode; ultra-thin chip packages; Assembly; Backplanes; Bonding; Consumer electronics; Contacts; Displays; Electronics packaging; Integrated circuit interconnections; Substrates; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics System-Integration Technology Conference, 2008. ESTC 2008. 2nd
Conference_Location
Greenwich
Print_ISBN
978-1-4244-2813-7
Electronic_ISBN
978-1-4244-2814-4
Type
conf
DOI
10.1109/ESTC.2008.4684367
Filename
4684367
Link To Document