Title :
Assembly of ultra-thin chip packages (UTCPs) for enhanced flexibility of flexible displays
Author :
Govaerts, Jonathan ; Vanfleteren, Jan
Author_Institution :
CMST - UGent / IMEC, Zwijnaarde
Abstract :
In this paper, a setup has been designed to test the assembly of UTCPs onto patterned flexible substrates. The assembly is carried out with Anisotropic Conductive Film (ACF) bonding, offering the advantages of fine pitch connection possibilities and low-temperature curing, often a requirement for flexible display backplanes. Furthermore, the UTCP has been designed with contacts at the four sides of the (square) package, and a matching thermode allows for all four sides to be bonded at the same time.
Keywords :
chip scale packaging; conducting materials; curing; fine-pitch technology; flexible displays; microassembling; anisotropic conductive film bonding; flexible displays; low-temperature curing; matching thermode; ultra-thin chip packages; Assembly; Backplanes; Bonding; Consumer electronics; Contacts; Displays; Electronics packaging; Integrated circuit interconnections; Substrates; Testing;
Conference_Titel :
Electronics System-Integration Technology Conference, 2008. ESTC 2008. 2nd
Conference_Location :
Greenwich
Print_ISBN :
978-1-4244-2813-7
Electronic_ISBN :
978-1-4244-2814-4
DOI :
10.1109/ESTC.2008.4684367
