Title :
Design and performance of metal conductors for stretchable electronic circuits
Author :
Gonzalez, Mario ; Axisa, Fabrice ; Bossuyt, Frederick ; Hsu, Yung-Yu ; Vandevelde, Bart ; Vanfleteren, Jan
Author_Institution :
IMEC-IPSI, Leuven
Abstract :
In this paper we review the mechanical properties and reliability results of stretchable interconnections used for electronic applications. These interconnections were produced by a Moulded Interconnect Device (MID) technology in which a specially designed metal interconnection if fully embedded with an elastic material such as polyurethane or silicone. In order to get a first impression of the expected damage in the interconnections, this research employs Finite Element Modelling (FEM) to analyse the physical behaviour of stretchable interconnects under different loading conditions. Moreover, the fatigue life of a copper interconnect embedded into a silicone matrix has been evaluated using the Coffin-Manson relation and FEM.
Keywords :
copper; fatigue; finite element analysis; integrated circuit interconnections; integrated circuit reliability; polymers; silicones; Cu; copper; fatigue; finite element modelling; mechanical properties; metal conductors; moulded interconnect device; polyurethane; reliability; silicone; stretchable interconnections; Biological materials; Conductors; Electronic circuits; Electronic components; Fatigue; Finite element methods; Integrated circuit interconnections; Mechanical factors; Polymers; Predictive models; FEM; Polyurethane; elastic; reliability; silicone; stretchable electronics;
Conference_Titel :
Electronics System-Integration Technology Conference, 2008. ESTC 2008. 2nd
Conference_Location :
Greenwich
Print_ISBN :
978-1-4244-2813-7
Electronic_ISBN :
978-1-4244-2814-4
DOI :
10.1109/ESTC.2008.4684377