DocumentCode
351569
Title
Various characteristics of crystal oscillator which applies technology of IC
Author
Makuta, Toshikasu ; Ishimaru, Chisato ; Okazaki, Masanobu
Author_Institution
Nihon Dempa Kogyo Co. Ltd., Saitama, Japan
Volume
1
fYear
1999
fDate
1999
Firstpage
343
Abstract
The processing technology of IC (Facedown bonding) is effective for making the low height IC. By using of Facedown bonding technique, we can develop the ultra slim crystal oscillator of 5×3.2×1.0 mm size. Furthermore by using the PLL technology, the output frequency can be realized in the 1-125 MHz range
Keywords
crystal oscillators; integrated circuit packaging; integrated circuit reliability; integrated circuit technology; microassembling; phase locked loops; 1 mm; 1 to 125 MHz; 1-125 MHz; 3.2 mm; 5 mm; IC; PLL technology; crystal oscillator; facedown bonding; output frequency; processing technology; ultra slim crystal oscillator; Bonding; Electric shock; Frequency; Integrated circuit packaging; Integrated circuit testing; Oscillators; Packaging machines; Petroleum; Phase noise; Wire;
fLanguage
English
Publisher
ieee
Conference_Titel
Frequency and Time Forum, 1999 and the IEEE International Frequency Control Symposium, 1999., Proceedings of the 1999 Joint Meeting of the European
Conference_Location
Besancon
ISSN
1075-6787
Print_ISBN
0-7803-5400-1
Type
conf
DOI
10.1109/FREQ.1999.840777
Filename
840777
Link To Document