Conductive adhesive-free surface mount type high frequency fundamental crystal resonators by gold bump bonding

Author

Iwate, H. ; Ishii, O.

Author_Institution

Toyo Commun. Equip. Co. Ltd., Kanagawa

Volume

1

fYear

1999

fDate

1999

Firstpage

461

Abstract

This paper describes the supporting structure of surface mount type crystal resonators suitable for operation at higher frequencies. This supporting structure applies gold bumps to bond a crystal chip to a ceramic package. The gold bump bonding is applied to AT-cut high frequency fundamental crystal resonators which have extremely thin vibrating parts. As a result, the effectiveness of gold bump bonding in heat-resistance, long-term stability, and conductive reliability are verified by the experimental characteristics of the above crystal resonators

Keywords

ceramic packaging; crystal resonators; gold; microassembling; reliability; stability; surface mount technology; 155 MHz; 622 MHz; AT-cut crystal; Au; Au bump bonding; HF fundamental crystal resonators; ceramic package; conductive adhesive-free crystal resonators; conductive reliability; crystal chip bonding; gold bumps; heat resistance; long-term stability; supporting structure; surface mount crystal resonators; Bonding; Ceramics; Conductive adhesives; Gold; Packaging; Residual stresses; Resonance; Resonant frequency; Tensile stress; Thermal stresses;

fLanguage

English

Publisher

ieee

Conference_Titel

Frequency and Time Forum, 1999 and the IEEE International Frequency Control Symposium, 1999., Proceedings of the 1999 Joint Meeting of the European

Conference_Location

Besancon

ISSN

1075-6787

Print_ISBN

0-7803-5400-1

Type

conf

DOI

10.1109/FREQ.1999.840806

Filename

840806