Title :
Conductive adhesive-free surface mount type high frequency fundamental crystal resonators by gold bump bonding
Author :
Iwate, H. ; Ishii, O.
Author_Institution :
Toyo Commun. Equip. Co. Ltd., Kanagawa
Abstract :
This paper describes the supporting structure of surface mount type crystal resonators suitable for operation at higher frequencies. This supporting structure applies gold bumps to bond a crystal chip to a ceramic package. The gold bump bonding is applied to AT-cut high frequency fundamental crystal resonators which have extremely thin vibrating parts. As a result, the effectiveness of gold bump bonding in heat-resistance, long-term stability, and conductive reliability are verified by the experimental characteristics of the above crystal resonators
Keywords :
ceramic packaging; crystal resonators; gold; microassembling; reliability; stability; surface mount technology; 155 MHz; 622 MHz; AT-cut crystal; Au; Au bump bonding; HF fundamental crystal resonators; ceramic package; conductive adhesive-free crystal resonators; conductive reliability; crystal chip bonding; gold bumps; heat resistance; long-term stability; supporting structure; surface mount crystal resonators; Bonding; Ceramics; Conductive adhesives; Gold; Packaging; Residual stresses; Resonance; Resonant frequency; Tensile stress; Thermal stresses;
Conference_Titel :
Frequency and Time Forum, 1999 and the IEEE International Frequency Control Symposium, 1999., Proceedings of the 1999 Joint Meeting of the European
Conference_Location :
Besancon
Print_ISBN :
0-7803-5400-1
DOI :
10.1109/FREQ.1999.840806
