DocumentCode :
351588
Title :
Modifications made to a COTS Rb standard for use under stressed operating conditions
Author :
Cantor, Stephen R. ; Stern, Adrian ; DiFranza, Michele J. ; Levy, Benny ; Agam, Yacov
Author_Institution :
MITRE Corp., Bedford, MA, USA
Volume :
1
fYear :
1999
fDate :
1999
Firstpage :
526
Abstract :
This paper is a report on the modifications made to a commercial-of-the-shelf (COTS) rubidium standard, AccuBeat´s model AR-60A, to enable it to be operated under significantly more stressed environmental conditions. Also, an enhancement of its warm-up time has been accomplished so that, at an ambient temperature of -54°C it will achieve lock within 3.8 minutes. The design of the AR-60A unit employs surface mount technology (SMT) plastic parts, which are susceptible to moisture absorption, and which the parts vendors specify must not be operated below -40°C. Consequently, there exists the potential of damage to those parts during the manufacturing assembly soldering process. This paper discusses how international standards, such as ANSI J-Standard-20 (which deals with the handling of moisture sensitive microcircuits) and EIA JESD 26 (which is a Joint European Standard dealing with specifications for plastic encapsulated microcircuits for use in rugged applications), are being applied to address this problem. The basic unmodified AR-60A consists of just 3 modules. The unit contains a microprocessor which optimizes its performance versus external disturbances. It has a unique back-up mode which keeps the internal OCXO running with the last memorized frequency when lock is lost. In addition, a built-in synthesizer allows a very fine digital frequency control over a wide range. In order to modify the COTS AR-60A unit at minimum cost, a heater-blanket was designed to surround the plastic parts so that the AR-60A circuits would not turn on below -40°C. Additionally, the OCXO was upgraded with a low g sensitivity crystal to provide enhanced phase-noise under vibration performance
Keywords :
atomic clocks; environmental degradation; environmental stress screening; frequency stability; frequency standards; phase noise; plastic packaging; reliability; rubidium; soldering; surface mount technology; -40 C; -54 C; ANSI J-Standard-20; AccuBeat model AR-60A; Allan variance; EIA JESD 26; Rb; SMT plastic parts; assembly soldering; built-in synthesizer; commercial-of-the-shelf standard; enhanced phase-noise; heater-blanket; internal OCXO; international standards; modifications; moisture absorption; stressed operating conditions; very fine digital frequency control; vibration performance; warm-up time enhancement; ANSI standards; Absorption; Assembly; Manufacturing processes; Microprocessors; Moisture; Plastics; Soldering; Surface-mount technology; Temperature;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Frequency and Time Forum, 1999 and the IEEE International Frequency Control Symposium, 1999., Proceedings of the 1999 Joint Meeting of the European
Conference_Location :
Besancon
ISSN :
1075-6787
Print_ISBN :
0-7803-5400-1
Type :
conf
DOI :
10.1109/FREQ.1999.840821
Filename :
840821
Link To Document :
بازگشت