• DocumentCode
    3515910
  • Title

    Compact RF-filter-modules with lumped elements in LTCC for applications up to 10GHz

  • Author

    Perrone, R. ; Muller, Johannes

  • fYear
    2008
  • fDate
    1-4 Sept. 2008
  • Firstpage
    491
  • Lastpage
    496
  • Abstract
    In this paper the design and realisation of one diplexer circuit for Tetra/UMTS (Tetra = terrestrialtrunked radio, Germany 380 - 390 MHz (Uplink) 390-400 MHz (Downlink), UMTS = WCDMA, 1.920 MHz - 1.980 MHz (Uplink) 2.110 MHz - 2.170 MHz (downlink)) and one low pass filter for 10 GHz in LTCC materials as independent modules with integrated lumped passives and LGA connections are discussed and the results presented. The target of this work was to achieve a high level of integration using the lowest possible number of LTCC layers and reducing the volume needs of the modules and consequently their production costs. Despite of the excellent integration properties of the LTCC technology, the optimal solution for the diplexer circuit was achieved using a hybrid topology. To achieve compact coils with a wide bandwidth and a high level of integration the modules were realised using fine line structures (width/space 50mum/50mum). Scattering simulations and measurement results are presented and discussed. Finally, through the examples presented in this paper the advantages and the potential of the passive integration in LTCC substrates from low frequencies up to frequencies above 10GHz are clearly shown.
  • Keywords
    low-pass filters; microwave filters; multiplexing equipment; passive filters; Tetra-UMTS; compact RF-filter-modules; diplexer circuit; frequency 1.920 MHz to 1.980 MHz; frequency 2.110 MHz to 2.170 MHz; frequency 380 MHz to 390 MHz; frequency 390 MHz to 400 MHz; integrated lumped passives; low pass filter; lumped elements; 3G mobile communication; Circuit topology; Coils; Costs; Downlink; Frequency; Low pass filters; Multiaccess communication; Production; Space technology;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics System-Integration Technology Conference, 2008. ESTC 2008. 2nd
  • Conference_Location
    Greenwich
  • Print_ISBN
    978-1-4244-2813-7
  • Electronic_ISBN
    978-1-4244-2814-4
  • Type

    conf

  • DOI
    10.1109/ESTC.2008.4684397
  • Filename
    4684397