Title :
Global joint effort to solve electronics supply chain technology issues
Author :
Bergman, Ruben ; Andrews, Marshall ; Collander, Paul
Author_Institution :
Poltronic, Alvsjo
Abstract :
High Density Packaging User Group, HDPUG, is an international consortium working with specific, most urgent, technology issues related to the changing world of electronics industry needs and complex supply chains. The organisation has for 12 years offered industrial top players a collaborative base for analysing, testing and improving emerging technologies at and before their public introduction. Suppliers and users working together at that stage improve business efficiency and performance up and down the supply chain.
Keywords :
fine-pitch technology; integrated circuit packaging; supply chains; surface mount technology; electronics supply chain technology; fine pitch surface mount technology; integrated circuit packaging; Chemical analysis; Chemical technology; Electronics industry; Electronics packaging; Europe; Industrial electronics; Isolation technology; Semiconductor device packaging; Supply chains; Testing;
Conference_Titel :
Electronics System-Integration Technology Conference, 2008. ESTC 2008. 2nd
Conference_Location :
Greenwich
Print_ISBN :
978-1-4244-2813-7
Electronic_ISBN :
978-1-4244-2814-4
DOI :
10.1109/ESTC.2008.4684410
