DocumentCode
3516456
Title
Growth mechanism of copper column by electrodeposition for electronic interconnections
Author
Liu, Jun ; Liu, Changqing ; Conway, Paul P.
Author_Institution
Wolfson Sch. of Mech. & Manuf. Eng., Loughborough Univ., Loughborough
fYear
2008
fDate
1-4 Sept. 2008
Firstpage
679
Lastpage
684
Abstract
Formation mechanism of copper columns by electrodeposition has been discussed by observing the evolution of surface morphology and microstructure of these columns electrodeposited from 16ms to 3 hours. Based on this study, a heuristic model is proposed to describe the growth mechanism of copper column which provides guidance for controlling microstructure of electrodeposited copper columns for fine pitch electronic interconnections.
Keywords
copper; crystal microstructure; electrodeposition; integrated circuit interconnections; surface morphology; Cu; copper columns; electrodeposition; fine pitch electronic interconnections; microstructure; surface morphology; time 16 ms to 3 h; Copper; Electrodes; Grain boundaries; Microelectronics; Microstructure; Packaging; Resists; Soldering; Surface morphology; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics System-Integration Technology Conference, 2008. ESTC 2008. 2nd
Conference_Location
Greenwich
Print_ISBN
978-1-4244-2813-7
Electronic_ISBN
978-1-4244-2814-4
Type
conf
DOI
10.1109/ESTC.2008.4684432
Filename
4684432
Link To Document