• DocumentCode
    3516618
  • Title

    3D-Mintegration: The design and manufacture of 3D miniaturised integrated products

  • Author

    Desmulliez, M.P.Y. ; Topham, D.

  • Author_Institution
    Microsyst. Eng. Centre, Heriot-Watt Univ., Edinburgh
  • fYear
    2008
  • fDate
    1-4 Sept. 2008
  • Firstpage
    737
  • Lastpage
    742
  • Abstract
    Integration on silicon is a mature procedure: well-tried compatible processes and well-characterised design methods routinely turn fantastic ideas into everyday commodities. But whole-product integration is another matter. This paper describes a UK-leading project to identify and develop revolutionary off-silicon manufacturing processes and to foster the insertion of these ground-breaking techniques into industry. Particular emphasis is placed upon the unexpected need for revisions of design philosophy to make the most of the new manufacturing techniques.
  • Keywords
    elemental semiconductors; integrated circuit packaging; silicon; 3D miniaturised integrated products; 3D-Mintegration; UK-leading project; off-silicon manufacturing processes; well-tried compatible processes; Assembly; Costs; Manufacturing industries; Manufacturing processes; Microassembly; Packaging; Product design; Prototypes; Semiconductor device manufacture; Silicon;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics System-Integration Technology Conference, 2008. ESTC 2008. 2nd
  • Conference_Location
    Greenwich
  • Print_ISBN
    978-1-4244-2813-7
  • Electronic_ISBN
    978-1-4244-2814-4
  • Type

    conf

  • DOI
    10.1109/ESTC.2008.4684442
  • Filename
    4684442