Thermal cycling fatigue analysis of copper pillar-to-solder joint reliability

Author

Pang, J.H.L. ; Wong, Stephen C K ; Neo, Sai Kiat ; Tan, Kok Ee

Author_Institution

Sch. of Mech. & Aerosp. Eng., Nanyang Technol. Univ., Singapore

fYear

2008

fDate

1-4 Sept. 2008

Firstpage

743

Lastpage

748

Abstract

This paper evaluates two novel copper pin-head pillar interconnection structures with solder joints suitable for fine-pitch, low stand-off height interconnection for flip chip technology. Current flip chip interconnection requires underfill encapsulation to meet the requirements in thermal cycling fatigue test. An alternative to underfill encapsulation for improving solder joint reliability is to implement copper pillar-to-solder joint assembly. Such a copper pillar solder joint method is designed to meet the solder joint reliability requirements of 500 cycles suitable for telecom and portable electronic products. Parametric studies were conducted using finite element analysis to investigate the effects of different copper pillar-to-solder joint geometries on the solder fatigue performance.

Keywords

copper; encapsulation; finite element analysis; flip-chip devices; integrated circuit interconnections; reliability; solders; wafer level packaging; copper pillar-to-solder joint geometries; copper pillar-to-solder joint reliability; finite element analysis; flip chip interconnection; flip chip technology; portable electronic products; telecom products; thermal cycling fatigue analysis; underfill encapsulation; wafer-level packages; Assembly; Copper; Design methodology; Encapsulation; Fatigue; Flip chip; Parametric study; Soldering; Telecommunications; Testing; CTE mismatch; copper pillar; pin-head interconnect; solder joint reliability; thermal cycling fatigue;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics System-Integration Technology Conference, 2008. ESTC 2008. 2nd

Conference_Location

Greenwich

Print_ISBN

978-1-4244-2813-7

Electronic_ISBN

978-1-4244-2814-4

Type

conf

DOI

10.1109/ESTC.2008.4684443

Filename

4684443