Fine pitch Cu wire bond process for integrated circuit devices for high volume production

Author

Schindler, Sebastian ; Wohnig, Markus ; Wolter, Klaus-Jiirgen

Author_Institution

Electron. Packaging Lab., Tech. Univ. Dresden, Dresden

fYear

2008

fDate

1-4 Sept. 2008

Firstpage

767

Lastpage

770

Abstract

Wire bonding is the most applied technology to realize an electric chip-to-package interconnection and to provide electrical paths from and to the substrate for power and signal distribution. Established in the 1970s, wire bonding has been well documented and researched as a result of continuous process improvement and through the development of sophisticated, automated equipment over the years, [1-2].

Keywords

ageing; chip-on-board packaging; circuit reliability; copper; integrated circuit interconnections; lead bonding; optical microscopy; oxidation; scanning electron microscopy; Cu; DoE methods; aging; chip-to-package interconnection; fine pitch Cu wire bond process; high humidity test; high temperature storage; high volume production; integrated circuit devices; metallographic sectioning; microstructural property; optical microscopy; oxidation; package reliability; reliability testing; scanning electron microscope techniques; shear tests; thermo cycling test; thermosonic ball bonding; Bonding forces; Bonding processes; Copper; Gold; Integrated circuit interconnections; Life testing; Materials testing; Optical microscopy; Production; Wire;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics System-Integration Technology Conference, 2008. ESTC 2008. 2nd

Conference_Location

Greenwich

Print_ISBN

978-1-4244-2813-7

Electronic_ISBN

978-1-4244-2814-4

Type

conf

DOI

10.1109/ESTC.2008.4684447

Filename

4684447