Title :
Fine pitch Cu wire bond process for integrated circuit devices for high volume production
Author :
Schindler, Sebastian ; Wohnig, Markus ; Wolter, Klaus-Jiirgen
Author_Institution :
Electron. Packaging Lab., Tech. Univ. Dresden, Dresden
Abstract :
Wire bonding is the most applied technology to realize an electric chip-to-package interconnection and to provide electrical paths from and to the substrate for power and signal distribution. Established in the 1970s, wire bonding has been well documented and researched as a result of continuous process improvement and through the development of sophisticated, automated equipment over the years, [1-2].
Keywords :
ageing; chip-on-board packaging; circuit reliability; copper; integrated circuit interconnections; lead bonding; optical microscopy; oxidation; scanning electron microscopy; Cu; DoE methods; aging; chip-to-package interconnection; fine pitch Cu wire bond process; high humidity test; high temperature storage; high volume production; integrated circuit devices; metallographic sectioning; microstructural property; optical microscopy; oxidation; package reliability; reliability testing; scanning electron microscope techniques; shear tests; thermo cycling test; thermosonic ball bonding; Bonding forces; Bonding processes; Copper; Gold; Integrated circuit interconnections; Life testing; Materials testing; Optical microscopy; Production; Wire;
Conference_Titel :
Electronics System-Integration Technology Conference, 2008. ESTC 2008. 2nd
Conference_Location :
Greenwich
Print_ISBN :
978-1-4244-2813-7
Electronic_ISBN :
978-1-4244-2814-4
DOI :
10.1109/ESTC.2008.4684447
