Title :
Effect of temperature on slumping behaviour of lead-free solder paste and its rheological simulation
Author :
Marks, A.E. ; Mallik, S. ; Ekere, N.N. ; Seman, A.
Author_Institution :
Electron. Manuf. Eng. Res. Group., Univ. of Greenwich, Chatham
Abstract :
Variation in temperature can have a significant impact on the rheological characterisation of solder pastes used in the electronic assembly of surface mount devices. This paper concerns the study of the effect of temperature on slumping characteristics of lead-free solder pastes. The identification of the slumping characteristics can help in the correlation of the pastes characteristics to its printing performance. Further issues, which aid in justifying the undertaking of such a study, include the temperature differences identified both at the squeegee during the print, and during reflow. Due to these temperature variations, it is imperative to understand how slump differs with a temperature gradient.
Keywords :
soldering; solders; surface mount technology; electronic assembly; lead-free solder paste; print quality; printing performance; rheological simulation; slumping behaviour; solder pastes; solidification temperature; surface mount devices; temperature 150 degC; temperature gradient; viscosity reduction; Elasticity; Electronic equipment; Environmentally friendly manufacturing techniques; Lead; Printing; Rheology; Soldering; Temperature; Testing; Viscosity;
Conference_Titel :
Electronics System-Integration Technology Conference, 2008. ESTC 2008. 2nd
Conference_Location :
Greenwich
Print_ISBN :
978-1-4244-2813-7
Electronic_ISBN :
978-1-4244-2814-4
DOI :
10.1109/ESTC.2008.4684459
