Electrodeposition of Sn-Ag solder alloy for electronics interconnection

Author

Yi Qin ; Wilcox, G.D. ; Liu, Changqing

Author_Institution

Inst. of Polymer Technol. & Mater. Eng., Loughborough Univ., Loughborough

fYear

2008

fDate

1-4 Sept. 2008

Firstpage

833

Lastpage

838

Abstract

Eutectic Sn3.5 wt.%Ag alloy is one of the most promising lead-free solders in wafer bumping for flip chip interconnection. The pyrophosphate-iodide based baths were investigated for the electroplating of Sn-Ag alloy. The effect of polyethylene glycol 600 (PEG 600) as a surfactant was studied, its addition proved to facilitate achieving the near eutectic composition of Sn-Ag alloy. Different morphologies of deposited films were analysed using scanning electron microscopy (SEM). X-ray diffraction results indicated that a biphasic structure of beta-Sn and epsiv-Ag₃Sn was present in the as-electroplated film.

Keywords

X-ray diffraction; electroplating; eutectic alloys; metallic thin films; polymers; scanning electron microscopy; silver alloys; surfactants; tin alloys; SEM; SnAg; X-ray diffraction; biphasic structure; electrodeposition; electronics interconnection; electroplating; eutectic alloy; films; polyethylene glycol 600; scanning electron microscopy; solder alloy; surfactant; Aluminum alloys; Bonding; Electrodes; Environmentally friendly manufacturing techniques; Lead; Polyethylene; Polymers; Printing; Scanning electron microscopy; Tin;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics System-Integration Technology Conference, 2008. ESTC 2008. 2nd

Conference_Location

Greenwich

Print_ISBN

978-1-4244-2813-7

Electronic_ISBN

978-1-4244-2814-4

Type

conf

DOI

10.1109/ESTC.2008.4684460

Filename

4684460