Title :
Electrodeposition of Sn-Ag solder alloy for electronics interconnection
Author :
Yi Qin ; Wilcox, G.D. ; Liu, Changqing
Author_Institution :
Inst. of Polymer Technol. & Mater. Eng., Loughborough Univ., Loughborough
Abstract :
Eutectic Sn3.5 wt.%Ag alloy is one of the most promising lead-free solders in wafer bumping for flip chip interconnection. The pyrophosphate-iodide based baths were investigated for the electroplating of Sn-Ag alloy. The effect of polyethylene glycol 600 (PEG 600) as a surfactant was studied, its addition proved to facilitate achieving the near eutectic composition of Sn-Ag alloy. Different morphologies of deposited films were analysed using scanning electron microscopy (SEM). X-ray diffraction results indicated that a biphasic structure of beta-Sn and epsiv-Ag3Sn was present in the as-electroplated film.
Keywords :
X-ray diffraction; electroplating; eutectic alloys; metallic thin films; polymers; scanning electron microscopy; silver alloys; surfactants; tin alloys; SEM; SnAg; X-ray diffraction; biphasic structure; electrodeposition; electronics interconnection; electroplating; eutectic alloy; films; polyethylene glycol 600; scanning electron microscopy; solder alloy; surfactant; Aluminum alloys; Bonding; Electrodes; Environmentally friendly manufacturing techniques; Lead; Polyethylene; Polymers; Printing; Scanning electron microscopy; Tin;
Conference_Titel :
Electronics System-Integration Technology Conference, 2008. ESTC 2008. 2nd
Conference_Location :
Greenwich
Print_ISBN :
978-1-4244-2813-7
Electronic_ISBN :
978-1-4244-2814-4
DOI :
10.1109/ESTC.2008.4684460
