Life-time test of laser soldered joints on flexible boards

Author

Illyefalvi-Vitéz, Zsolt ; Balogh, B. ; Baranyay, Zsolt ; Bátorfi, Réka ; Farmer, Graham

Author_Institution

Dept. of Electron. Technol., Budapest Univ. of Technol. & Econ., Budapest

fYear

2008

fDate

1-4 Sept. 2008

Firstpage

877

Lastpage

884

Abstract

Laser soldering experiments were carried out in respect of lead-free solder materials and flexible board combinations. Polyimide (PI), polyethylene-naphthalate (PEN) and Polyester (PET) flexible copper clad foils with temperature limits of 270degC (PI); 180degC (PEN); 150degC (PET) were tested using the popular SAC (SnAg3.8Cu0.7) lead-free solder with melting point of 217degC, or the low temperature 58Bi42Sn lead-free solder with melting point of 138degC. Substrates with different adhesives and cover layers were used. Application oriented test boards were designed to investigate the laser soldering process and the quality of the resulting solder joints, regarding such field applications as soldering surface mount components onto flexible boards and attaching flexible board/cable to rigid board, in particular if the temperature limit of the flexible foil is lower than the melting point of the solder. The paper discusses the performance of laser soldered joints on flexible boards regarding optical inspection, shear strength, joint resistance and life time tests.

Keywords

joining materials; laser beam machining; polymers; shear strength; soldering; flexible boards; flexible copper clad foils; laser soldering; life-time test; polyester; polyethylene-naphthalate; polyimide; shear strength; solder joints; Copper; Environmentally friendly manufacturing techniques; Lead; Life testing; Optical design; Optical materials; Polyimides; Positron emission tomography; Soldering; Temperature;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics System-Integration Technology Conference, 2008. ESTC 2008. 2nd

Conference_Location

Greenwich

Print_ISBN

978-1-4244-2813-7

Electronic_ISBN

978-1-4244-2814-4

Type

conf

DOI

10.1109/ESTC.2008.4684468

Filename

4684468