A Study on Mobile Communication Device Structure Design Resisting Dust Particles Ingress

The reliability of mobile communication devices is affected by many factors, such as structure design, mechanical and electrical characteristic of devices, electromagnetic disturbance, electrical contact, dynamic environmental, temperature changes, , environmental pollution, etc. Studies show that 14% failure of the electronic products is caused by dust and salt mist. Dust particles ingress electronic device, and contaminate the internal components. This results in electric contact failure and reduced reliability of contact components. It is a very important consideration in electronic product design to protect internal components from operational impairment that due to ingress of dust particles and reduce the impact of dust on the communication device. This paper studies the ability of mobile communication device structure design to resist dust particles ingress and penetration the internal areas. It gives the dust distribution in the mobile phone by experiments and finite element analysis (FEA) using a mobile phone as the representation of the mobile communication device; it provides guidance for structure design and improves reliability of portable electronic products in the future.