DocumentCode
3517207
Title
Interface-state-induced degradation of GIDL current in n-MOSFETs under hot-carrier stress
Author
Lai, P.T. ; Xu, J.P. ; Zeng, X. ; Liu, B.Y.
Author_Institution
Dept. of Electr. & Electron. Eng., Hong Kong Univ., Hong Kong
fYear
1996
fDate
35245
Firstpage
102
Lastpage
105
Abstract
The dependence of increase in post-stress gate-induced-drain-leakage (GIDL) current in n-MOSFET´s on creation of interface states (ΔDit) during hot-carrier stress with VG = 0.5 VD was investigated. An interface-trap-assisted tunneling conduction mechanism is proposed to account for the increase. The stress method of VG = 0.5 VD can generate a lot of interface traps near the valence band in thermal oxide samples, which is considerably suppressed in nitrided oxide samples. From the linear relationship between increase in post-stress GIDL current and created interface-state density during hot-carrier stress, ΔDit values can be estimated
Keywords
MOSFET; hot carriers; interface states; leakage currents; GIDL current; gate-induced-drain-leakage current; hot-carrier stress; interface states; interface traps; n-MOSFET; nitrided oxide; thermal oxide; tunneling conduction; Current measurement; Degradation; Electron traps; Hot carriers; Interface states; MOSFET circuits; Rapid thermal processing; Stress measurement; Tunneling; Virtual colonoscopy;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices Meeting, 1996., IEEE Hong Kong
Print_ISBN
0-7803-3091-9
Type
conf
DOI
10.1109/HKEDM.1996.566329
Filename
566329
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