Title :
Mechanical characterisation of thin metal layers by modelling of the nanoindentation experiment
Author :
Wittler, Olaf ; Mrossko, R. ; Kaulfersch, Eberhard ; Wunderle, Bernhard ; Michel, Bruno
Author_Institution :
Micro Mater. Center Berlin, Fraunhofer IZM, Berlin
Abstract :
Obtaining material data for thin metal layers is a mayor issue in the reliability assessment of microelectronic products. Therefore a method for obtaining elastic-plastic material data is analyzed and discussed in this paper. It is based on the nanoindentation of a film on a silicon substrate and the modeling of it. Thus it becomes possible to fit specific material models to the indentation experiment. Results are shown for two AlSiCu layers.
Keywords :
aluminium alloys; copper alloys; elastoplasticity; indentation; metallic thin films; silicon alloys; AlSiCu; AlSiCu layers; Si; elastic-plastic material; film; nanoindentation; silicon substrate; thin metal layers; Data analysis; Finite element methods; Inorganic materials; Materials reliability; Microelectronics; Semiconductor device modeling; Semiconductor films; Silicon; Substrates; Thermomechanical processes;
Conference_Titel :
Electronics System-Integration Technology Conference, 2008. ESTC 2008. 2nd
Conference_Location :
Greenwich
Print_ISBN :
978-1-4244-2813-7
Electronic_ISBN :
978-1-4244-2814-4
DOI :
10.1109/ESTC.2008.4684488
