Encapsulation of systems in package - process characterization and optimization

Author

Schreier-Alt, Thomas ; Schindler-Saefkow, Florian ; Wittler, Olaf ; Kittel, Hartmut

Author_Institution

Micro Mechatron. Syst., Fraunhofer IZM, Wessling

fYear

2008

fDate

1-4 Sept. 2008

Firstpage

1017

Lastpage

1022

Abstract

This paper investigates different stress and strain measurement methods usable during packaging of electronic systems. By applying stress measurement chips, embedded fiber optic Bragg grating (FBG) sensors and pressure sensitive multilayers it is possible to determine the stress condition on the surface of silicon chips, on various substrates and within epoxy polymers.

Keywords

Bragg gratings; encapsulation; microsensors; moulding; polymerisation; system-in-package; CTE mismatch; FBG sensor; Homogenous pressure distribution; MEMS sensors; electronic systems. packaging; embedded fiber optic Bragg grating sensors; encapsulation; epoxy molding compounds; exothermal material polymerization; industrial transfer molding processes; mechanical forces; polymer gelling; polymer shrinkage; polymer vitrification; pressure assisted injection; pressure sensitive multilayers; silicon chip surface; size 1 mm to 5 mm; strain measurement methods; stress condition; stress measurement chip; stress measurement methods; systems in package; time 16 ms; Bragg gratings; Electronics packaging; Encapsulation; Fiber gratings; Optical fiber sensors; Optical fibers; Optical sensors; Sensor phenomena and characterization; Strain measurement; Stress measurement;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics System-Integration Technology Conference, 2008. ESTC 2008. 2nd

Conference_Location

Greenwich

Print_ISBN

978-1-4244-2813-7

Electronic_ISBN

978-1-4244-2814-4

Type

conf

DOI

10.1109/ESTC.2008.4684491

Filename

4684491