Title :
Encapsulation of systems in package - process characterization and optimization
Author :
Schreier-Alt, Thomas ; Schindler-Saefkow, Florian ; Wittler, Olaf ; Kittel, Hartmut
Author_Institution :
Micro Mechatron. Syst., Fraunhofer IZM, Wessling
Abstract :
This paper investigates different stress and strain measurement methods usable during packaging of electronic systems. By applying stress measurement chips, embedded fiber optic Bragg grating (FBG) sensors and pressure sensitive multilayers it is possible to determine the stress condition on the surface of silicon chips, on various substrates and within epoxy polymers.
Keywords :
Bragg gratings; encapsulation; microsensors; moulding; polymerisation; system-in-package; CTE mismatch; FBG sensor; Homogenous pressure distribution; MEMS sensors; electronic systems. packaging; embedded fiber optic Bragg grating sensors; encapsulation; epoxy molding compounds; exothermal material polymerization; industrial transfer molding processes; mechanical forces; polymer gelling; polymer shrinkage; polymer vitrification; pressure assisted injection; pressure sensitive multilayers; silicon chip surface; size 1 mm to 5 mm; strain measurement methods; stress condition; stress measurement chip; stress measurement methods; systems in package; time 16 ms; Bragg gratings; Electronics packaging; Encapsulation; Fiber gratings; Optical fiber sensors; Optical fibers; Optical sensors; Sensor phenomena and characterization; Strain measurement; Stress measurement;
Conference_Titel :
Electronics System-Integration Technology Conference, 2008. ESTC 2008. 2nd
Conference_Location :
Greenwich
Print_ISBN :
978-1-4244-2813-7
Electronic_ISBN :
978-1-4244-2814-4
DOI :
10.1109/ESTC.2008.4684491
