DocumentCode
3517447
Title
Ultrasonic flaw detection using sparse representation for failure analysis of next generation microelectronic packages
Author
Zhang, Guangming ; Harvey, David M. ; Braden, Derek R.
Author_Institution
Gen. Eng. Res. Inst., Liverpool John Moores Univ., Liverpool
fYear
2008
fDate
1-4 Sept. 2008
Firstpage
1045
Lastpage
1050
Abstract
In this paper, a sparse Bayesian learning-based ultrasonic signal processing method is designed to detect and characterize flaws in thin multilayer structures, where the reflectivity is sparse. Sparse Bayesian learning is first used to decompose an ultrasonic signal into sparse signal representations over an overcomplete dictionary that is learnt from a training data set in advance. Ultrasonic flaw detection is then carried out on the basis of the sparse signal representations. The performance of the proposed method is experimentally verified using ultrasonic traces acquired from microelectronic packages by a scanning acoustic microscope.
Keywords
acoustic microscopy; electronics packaging; flaw detection; multilayers; ultrasonic materials testing; microelectronic packages; scanning acoustic microscope; sparse Bayesian learning-based ultrasonic signal processing method; sparse signal representations; thin multilayer structures; ultrasonic flaw detection; ultrasonic signal; ultrasonic traces; Bayesian methods; Design methodology; Failure analysis; Microelectronics; Nonhomogeneous media; Packaging; Process design; Signal design; Signal processing; Signal representations;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics System-Integration Technology Conference, 2008. ESTC 2008. 2nd
Conference_Location
Greenwich
Print_ISBN
978-1-4244-2813-7
Electronic_ISBN
978-1-4244-2814-4
Type
conf
DOI
10.1109/ESTC.2008.4684496
Filename
4684496
Link To Document