• DocumentCode
    3517447
  • Title

    Ultrasonic flaw detection using sparse representation for failure analysis of next generation microelectronic packages

  • Author

    Zhang, Guangming ; Harvey, David M. ; Braden, Derek R.

  • Author_Institution
    Gen. Eng. Res. Inst., Liverpool John Moores Univ., Liverpool
  • fYear
    2008
  • fDate
    1-4 Sept. 2008
  • Firstpage
    1045
  • Lastpage
    1050
  • Abstract
    In this paper, a sparse Bayesian learning-based ultrasonic signal processing method is designed to detect and characterize flaws in thin multilayer structures, where the reflectivity is sparse. Sparse Bayesian learning is first used to decompose an ultrasonic signal into sparse signal representations over an overcomplete dictionary that is learnt from a training data set in advance. Ultrasonic flaw detection is then carried out on the basis of the sparse signal representations. The performance of the proposed method is experimentally verified using ultrasonic traces acquired from microelectronic packages by a scanning acoustic microscope.
  • Keywords
    acoustic microscopy; electronics packaging; flaw detection; multilayers; ultrasonic materials testing; microelectronic packages; scanning acoustic microscope; sparse Bayesian learning-based ultrasonic signal processing method; sparse signal representations; thin multilayer structures; ultrasonic flaw detection; ultrasonic signal; ultrasonic traces; Bayesian methods; Design methodology; Failure analysis; Microelectronics; Nonhomogeneous media; Packaging; Process design; Signal design; Signal processing; Signal representations;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics System-Integration Technology Conference, 2008. ESTC 2008. 2nd
  • Conference_Location
    Greenwich
  • Print_ISBN
    978-1-4244-2813-7
  • Electronic_ISBN
    978-1-4244-2814-4
  • Type

    conf

  • DOI
    10.1109/ESTC.2008.4684496
  • Filename
    4684496