• DocumentCode
    3517593
  • Title

    Long term cost of ownership: beyond purchase price [chip manufacture]

  • Author

    Carnes, Ross ; Su, May

  • Author_Institution
    SEMATECH, Austin, TX, USA
  • fYear
    1991
  • fDate
    20-22 May 1991
  • Firstpage
    39
  • Lastpage
    43
  • Abstract
    An economic cost of ownership model is developed to estimate the total cost per wafer for a given process operation. The model incorporates fixed and variable costs and process tool specific as well as fab specific cost inputs. While all the variables can affect the final outcome, it is shown that the long-term cost per wafer for a given process is directly proportional to both mechanical throughput yield and defect densities. Wafer cost is also extremely sensitive to throughput, which affects both the fixed and variable cost components. Due to the nonlinear relationship of wafer cost and factors affecting equipment utilization capability, cost reduction through reliability improvement may be effective depending on where the nominal baseline points are located on the curves. Changes in inputs such as initial equipment costs or engineering support hours have less impact on the final cost per wafer since these variables affect only one cost component of the model
  • Keywords
    economics; integrated circuit manufacture; IC manufacture; cost reduction; defect densities; economic cost of ownership model; engineering support hours; equipment utilization capability; fab specific cost inputs; initial equipment costs; mechanical throughput yield; process operation; process tool specific costs; reliability improvement; total cost per wafer; Costs; Job shop scheduling; Life estimation; Lifetime estimation; Manufacturing processes; Semiconductor device manufacture; Semiconductor device modeling; Semiconductor process modeling; Sensitivity analysis; Throughput;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Manufacturing Science Symposium, 1991. ISMSS 1991., IEEE/SEMI International
  • Conference_Location
    Burlingame, CA
  • Print_ISBN
    0-7803-0027-0
  • Type

    conf

  • DOI
    10.1109/ISMSS.1991.146264
  • Filename
    146264