Title :
MicroLens/UV-LED array packaging for dynamic and static alignment
Author :
Luetzelschwab, M. ; Desmulliez, Marc Philippe Y. ; Weiland, D.
Author_Institution :
Microsyst. Eng. Centre, Heriot-Watt Univ., Edinburgh
Abstract :
This paper presents a fully integrated packaging solution that permits the static and active alignment of a microLens array placed on top of a micro-UV-LED array. The entire process is manufactured by UV-lithography using predominantly the photoresists SU8 and THB. The processing temperature for all steps is below 120degC.
Keywords :
electronics packaging; light emitting diodes; microlenses; photoresists; ultraviolet lithography; SU8 photoresist; THB photoresist; UV-lithography; active alignment; microLens-UV-LED array packaging; static alignment; Bonding; Electrodes; Electrostatic actuators; Fabrication; Insulation life; Lenses; Light emitting diodes; Manufacturing processes; Microoptics; Packaging;
Conference_Titel :
Electronics System-Integration Technology Conference, 2008. ESTC 2008. 2nd
Conference_Location :
Greenwich
Print_ISBN :
978-1-4244-2813-7
Electronic_ISBN :
978-1-4244-2814-4
DOI :
10.1109/ESTC.2008.4684509
