DocumentCode :
3517713
Title :
Reliability of semiconductor laser packaging in space applications
Author :
Gontijo, Ivair ; Qiu, Yueming ; Shapiro, Andrew A.
Author_Institution :
Jet Propulsion Lab., California Inst. of Technol., Pasadena, CA
fYear :
2008
fDate :
1-4 Sept. 2008
Firstpage :
1127
Lastpage :
1130
Abstract :
A typical set up used to perform lifetime tests of packaged, fiber pigtailed semiconductor lasers is described, as well as tests performed on a set of four pump lasers. It was found that two lasers failed after 3200 and 6100 hours under device specified bias conditions at elevated temperatures. Failure analysis of the lasers indicates imperfections and carbon contamination of the laser metallization, possibly from improperly cleaned photo resist. SEM imaging of the front facet of one of the lasers, although of poor quality due to the optical fiber charging effects, shows evidence of catastrophic damage at the facet. More stringent manufacturing controls with 100% visual inspection of laser chips are needed to prevent imperfect lasers from proceeding to packaging and ending up in space applications, where failure can result in the loss of a space flight mission.
Keywords :
metallisation; optical pumping; photoresists; scanning electron microscopy; semiconductor device packaging; semiconductor lasers; SEM imaging; carbon contamination; catastrophic damage; fiber pigtailed semiconductor lasers; laser chips inspection; laser metallization; optical fiber charging effects; photoresist; pump lasers; semiconductor laser packaging; space applications; space flight mission; Fiber lasers; Lifetime estimation; Optical fiber devices; Optical fiber testing; Performance evaluation; Pump lasers; Semiconductor device packaging; Semiconductor device reliability; Semiconductor lasers; Space missions;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics System-Integration Technology Conference, 2008. ESTC 2008. 2nd
Conference_Location :
Greenwich
Print_ISBN :
978-1-4244-2813-7
Electronic_ISBN :
978-1-4244-2814-4
Type :
conf
DOI :
10.1109/ESTC.2008.4684510
Filename :
4684510
Link To Document :
بازگشت