Investigation of the moisture impact on the stacked die package

Stacked die package is a key technique to meet the requirements of smaller size and higher density of electronic products. Moisture plays an important role in the reliability of electronic devices, especially with high temperature, in which the major failures are from corrosion, delamination and crack. The delamination and crack make the device to be easily weak and sensitive to external environment. And other failures, such as leakage current and open circuit could be caused by moisture corrosion. The moisture induced failure in the stacked die packaging has been studied in this work. The moisture absorption test was experimentally carried out under different conditions according to JEDEC standard. Thru Scanning Acoustic Microscope (T-SAM) and Scanning Electron Microscope (SEM) were used for further investigation. The elimination of such failure and how to control the moisture absorption still need to be studied.