DocumentCode :
3517938
Title :
Current leakage failure of conformally coated electronic assemblies
Author :
Dou, Guangbin ; Webb, D. Patrick ; Whalley, David C. ; Hutt, David A. ; Wilson, Antony R.
Author_Institution :
Electr. & Electron. Eng., Imperial Coll. London, London
fYear :
2008
fDate :
1-4 Sept. 2008
Firstpage :
1213
Lastpage :
1218
Abstract :
Conformal coatings are widely used on circuit board assemblies as an attempt to improve reliability and to ensure high insulation impedances, which are for example demanded by low current consumption battery operated RF circuitry. However, components, such as small ceramic capacitors, have occasionally been found to fail in some applications, particularly when covered with a thick silicone conformal coating. This is thought to be due to the diffusion of water through the coating to the capacitor surface where it then combines with solder flux residue, or other organic or ionic contamination left on the components, thereby dramatically increasing the effective component leakage current. The primary objective of this experimental research is therefore to establish a clear understanding of the effects of moisture exposure on the surface insulation resistance (SIR) of conformally coated printed circuit board (PCB) assemblies. This has been achieved through leakage current measurements on multilayer ceramic capacitors during storage in an environmental chamber during testing similar to IPC standards for non-component loaded boards.
Keywords :
ceramic capacitors; circuit reliability; leakage currents; printed circuits; PCB; RF circuitry; capacitor surface; ceramic capacitors; component leakage current; conformal coatings; conformally coated printed circuit board assemblies; current leakage failure; diffusion; electronic assemblies; insulation impedances; ionic contamination; low current consumption battery; moisture exposure; multilayer ceramic capacitors; organic contamination; reliability; solder flux residue; surface insulation resistance; thick silicone conformal coating; Assembly; Capacitors; Ceramics; Coatings; Impedance; Insulation; Leakage current; Printed circuits; Surface contamination; Surface resistance;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics System-Integration Technology Conference, 2008. ESTC 2008. 2nd
Conference_Location :
Greenwich
Print_ISBN :
978-1-4244-2813-7
Electronic_ISBN :
978-1-4244-2814-4
Type :
conf
DOI :
10.1109/ESTC.2008.4684526
Filename :
4684526
Link To Document :
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