“glassPack” — photonic packaging using thin glass foils for electrical-optical circuit boards (EOCB) and sensor modules

Author

Schröder, Henning ; Arndt-Staufenbiel, N. ; Brusberg, Lars

Author_Institution

Fraunhofer Inst. for Reliability & Microintegration IZM, Berlin

fYear

2008

fDate

1-4 Sept. 2008

Firstpage

1245

Lastpage

1250

Abstract

The ldquoglassPackrdquo-concept will be introduced as a new packaging technologies platform for a wide area of opto-electronic applications like optical backplane, electrical-optical circuit boards (EOCB) and sensors. The usage of thin glass foils of some tens of microns thickness as substrate and interconnection material is the crucial point of the concept. First realizations will be presented.

Keywords

electro-optical devices; electronics packaging; integrated optoelectronics; optical backplanes; optical sensors; printed circuits; electrical-optical circuit boards; electrical-optical sensors; glassPack; interconnection material; optical backplane; optoelectronic applications; packaging technologies; photonic packaging; thin glass foils; Glass; Optical attenuators; Optical interconnections; Optical polymers; Optical refraction; Optical sensors; Optical waveguides; Optoelectronic and photonic sensors; Packaging; Printed circuits;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics System-Integration Technology Conference, 2008. ESTC 2008. 2nd

Conference_Location

Greenwich

Print_ISBN

978-1-4244-2813-7

Electronic_ISBN

978-1-4244-2814-4

Type

conf

DOI

10.1109/ESTC.2008.4684532

Filename

4684532