Title :
“glassPack” — photonic packaging using thin glass foils for electrical-optical circuit boards (EOCB) and sensor modules
Author :
Schröder, Henning ; Arndt-Staufenbiel, N. ; Brusberg, Lars
Author_Institution :
Fraunhofer Inst. for Reliability & Microintegration IZM, Berlin
Abstract :
The ldquoglassPackrdquo-concept will be introduced as a new packaging technologies platform for a wide area of opto-electronic applications like optical backplane, electrical-optical circuit boards (EOCB) and sensors. The usage of thin glass foils of some tens of microns thickness as substrate and interconnection material is the crucial point of the concept. First realizations will be presented.
Keywords :
electro-optical devices; electronics packaging; integrated optoelectronics; optical backplanes; optical sensors; printed circuits; electrical-optical circuit boards; electrical-optical sensors; glassPack; interconnection material; optical backplane; optoelectronic applications; packaging technologies; photonic packaging; thin glass foils; Glass; Optical attenuators; Optical interconnections; Optical polymers; Optical refraction; Optical sensors; Optical waveguides; Optoelectronic and photonic sensors; Packaging; Printed circuits;
Conference_Titel :
Electronics System-Integration Technology Conference, 2008. ESTC 2008. 2nd
Conference_Location :
Greenwich
Print_ISBN :
978-1-4244-2813-7
Electronic_ISBN :
978-1-4244-2814-4
DOI :
10.1109/ESTC.2008.4684532
