Development and investigation of horizontal elements in 3D micro-contacts and structures

The present article describes the development and production of horizontal elements in 3D micro-contacts, implemented in IC package to PCB assembly and micro mechanical actuators. Instead of the standard vacuum deposition of metal films onto dielectric interfaces and lift-off stripping, an alternative method aiming at simplicity and lower-cost, relative to the technology roadmap is proposed. This method employs chemical activation and pre-treatment of the dielectric photoresist surfaces with fluid carbon content substance, thus providing also electrical conductivity for direct metal electroplating. A special regime of reverse electrochemical deposition is applied in order to enhance the adhesion of the layer, deposited onto the activated surface. This paper presents experimental results of the horizontal elements investigation, relative to the 3D micro-contacts. Thermal simulations of the proposed structures are also included. This issue is of a great importance, due to the nature of the horizontal elements - actuator type and bending features.