Metallographic analysis of laser soldered chip resistors

Author

Hurtony, Tamás ; Balogh, Bálint ; Pintér, Dániel ; Lénárt, Gyula

Author_Institution

Dept. of Electron. Technol., Budapest Univ. of Technol. & Econ., Budapest, Hungary

fYear

2010

fDate

12-16 May 2010

Firstpage

123

Lastpage

127

Abstract

During the last decade laser material processing has been used in more and more fields of electronics technology. Among these techniques laser soldering processes showed great improvements and they offer several advantages mainly in terms of localized heating, rapid rise and fall in temperature, non-contact and easily automated process. This paper presents a systematic experimental investigation, which was aimed at finding relation between the most significant laser soldering parameters (soldering time and average power) and the intermetallic layer thickness and the microstructure of the solder joint. We applied defocused frequency tripled Nd:YAG laser beam on simple SMD chip resistors. The solder joints were qualified by resistance measurements, X-ray micrographs, shear tests, and the microstructure of the solder joint was analyzed with SEM on cross-section samples.

Keywords

laser materials processing; measurement systems; metallography; resistors; scanning electron microscopy; soldering; SEM; SMD chip resistors; X-ray micrographs; YAG:Nd; automated process; average power; electronics technology; intermetallic layer thickness; laser soldered chip resistors; localized heating; metallographic analysis; microstructure; resistance measurements; shear tests; solder joint; soldering time; Laser applications; Laser beams; Microstructure; Resistors; Soldering; X-ray lasers;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Technology (ISSE), 2010 33rd International Spring Seminar on

Conference_Location

Warsaw

Print_ISBN

978-1-4244-7849-1

Electronic_ISBN

978-1-4244-7850-7

Type

conf

DOI

10.1109/ISSE.2010.5547269

Filename

5547269