DocumentCode :
3518210
Title :
High Performance THANVaS Memories for MLC Charge Trap NAND Flash
Author :
Suhane, A. ; Van den Bosch, G. ; Arreghini, A. ; Breuil, L. ; Cacciato, A. ; Zahid, M.B. ; Debusschere, I. ; De Meyer, K. ; Van Houdt, J.
Author_Institution :
imec, Leuven, Belgium
fYear :
2011
fDate :
22-25 May 2011
Firstpage :
1
Lastpage :
4
Abstract :
In this paper we investigate THANOS and THANVaS memory devices featuring a 2 nm HfO2 capping layer on top of the AI2O3 blocking dielectric. Furthermore, we benchmark these devices against reference TANOS and TANOS with variable tunnel oxide thickness (TANVaS), respectively. It is found that HfO2 capping layer improves erase saturation level due to its better electron blocking capabilities during erase operation, as also confirmed by simulations. As a result of improved erase saturation, THANVaS device shows excellent performance of 9.5 V memory window with flat endurance up to 104 cycles and improved high temperature retention.
Keywords :
NAND circuits; alumina; aluminium compounds; flash memories; hafnium compounds; silicon compounds; tantalum compounds; Al2O3; HfO2; MLC charge trap NAND flash; TANOS with variable tunnel oxide thickness; THANOS memory devices; THANVaS memory devices; TaN-AlO-SiN-SiO-Si; capping layer; electron blocking capabilities; erase saturation level; high temperature retention; size 2 nm; voltage 9.5 V; Aluminum oxide; Charge carrier processes; Logic gates; Performance evaluation; Programming; Transient analysis;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Memory Workshop (IMW), 2011 3rd IEEE International
Conference_Location :
Monterey, CA
Print_ISBN :
978-1-4577-0225-9
Electronic_ISBN :
978-1-4577-0224-2
Type :
conf
DOI :
10.1109/IMW.2011.5873210
Filename :
5873210
Link To Document :
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