Title :
Modeling and analysis of return-current paths for microstrip-to-microstrip via transitions
Author :
Ndip, Ivan ; Ohnimus, Florian ; Guttowski, Stephan ; Reichl, Herbert
Author_Institution :
IZM, Fraunhofer Inst. for Reliability & Microintegration, Berlin
Abstract :
In this contribution, the return-current paths for single-ended microstrip-to-microstrip via transitions in conventional layer stack-ups are modeled and analyzed. Electromagnetic reliability (EMR) problems which occur in these layer stack-ups, because the return-currents are not properly managed are discussed. Finally, a layer stack-up with well defined return-current paths, which overcomes the limitations of traditional layer stack-ups, is proposed.
Keywords :
integrated circuit reliability; microstrip circuits; electromagnetic reliability; layer stack-ups; microstrip-to-microstrip via transitions; return-current paths; Conductors; Electromagnetic radiation; Electromagnetic scattering; Energy management; Frequency; Inductance; Microstrip; Packaging; Power generation; Switches;
Conference_Titel :
Electronics System-Integration Technology Conference, 2008. ESTC 2008. 2nd
Conference_Location :
Greenwich
Print_ISBN :
978-1-4244-2813-7
Electronic_ISBN :
978-1-4244-2814-4
DOI :
10.1109/ESTC.2008.4684546
