DocumentCode
3518230
Title
Evidence of energetically-localized trap-states at SOI-BOX interface in high-dose SIMOX wafers
Author
Ushiki, T. ; Kotani, K. ; Funaki, T. ; Kawai, K. ; Ohmi, T.
Author_Institution
New Ind. Creation Hatchery Center, Tohoku Univ., Sendai, Japan
fYear
1999
fDate
4-7 Oct. 1999
Firstpage
48
Lastpage
49
Abstract
As the trend in SOI technology continues to be towards thin-film devices, it is important to take a closer look at the electrically active defects at SOI-BOX interface, which could strongly affect the performance and reliability of SOI devices (Cristoloveanu, 1995). Although several studies on the interface trap densities at the SOI-BOX interface of SIMOX wafers have been reported (Nakashima et al, 1998; Yang et al., 1992), comprehensive analysis of these electrically active defects has not yet been fully studied, despite its scientific interest and technological importance. The purpose of this paper is to show for the first time that extraordinary kink effects have been experimentally observed in back-gate transconductance (g/sub m2/) characteristics of fully-depleted (FD) SOI MOS transistors on high-dose SIMOX wafers, and a physical explanation has been found.
Keywords
MOSFET; SIMOX; buried layers; dielectric thin films; doping profiles; electron traps; hole traps; interface states; semiconductor device measurement; semiconductor device models; SIMOX wafers; SOI device performance; SOI device reliability; SOI technology; SOI-BOX interface; Si-SiO/sub 2/; back-gate transconductance; electrically active defects; energetically-localized trap-states; fully-depleted SOI MOS transistors; high-dose SIMOX wafers; interface trap density; kink effects; thin-film devices; Electron traps; Equations; Implants; Iron; MOS devices; MOSFETs; Semiconductor device modeling; Thin film devices; Transconductance; Wafer bonding;
fLanguage
English
Publisher
ieee
Conference_Titel
SOI Conference, 1999. Proceedings. 1999 IEEE International
Conference_Location
Rohnert Park, CA, USA
ISSN
1078-621X
Print_ISBN
0-7803-5456-7
Type
conf
DOI
10.1109/SOI.1999.819852
Filename
819852
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