Title :
Mechanical cycling of isotropic conductive adhesives
Author :
Morris, J.E. ; Niiranen, Sini ; Mattila, Toni
Author_Institution :
Dept. of Electr. & Comput. Eng., Portland State Univ., Portland, OR, USA
Abstract :
Cyclic mechanical shear testing of isotropic conductive adhesives (ICAs) at ambient temperature reveals both viscoelastic behavior and a reproducible stress plateau. The failure mechanism is typically adhesive, rather than cohesive. Tentative explanations of the viscoelasticity and plateau are offered in terms of filler particle movement and structural layering within the epoxy matrix.
Keywords :
adhesives; failure (mechanical); mechanical testing; viscoelasticity; cyclic mechanical shear testing; epoxy matrix; failure mechanism; filler particle movement; isotropic conductive adhesives; mechanical cycling; reproducible stress plateau; structural layering; viscoelastic behavior; viscoelasticity; Conductive adhesives; Force; Reliability; Springs; Strain; Stress; Testing;
Conference_Titel :
Electronics Technology (ISSE), 2010 33rd International Spring Seminar on
Conference_Location :
Warsaw
Print_ISBN :
978-1-4244-7849-1
Electronic_ISBN :
978-1-4244-7850-7
DOI :
10.1109/ISSE.2010.5547275
