Title :
[Copyright notice]
Abstract :
The following topics are dealt with: solders; electronics packaging; LTCC layers; power semiconductor devices; wire bonding; printed circuit board; LED; electronic module reliability; CMOS integrated circuit design; sensors; antennas; electric engineering education; and radio network.
Keywords :
CMOS integrated circuits; antennas; electrical engineering education; electronics packaging; integrated circuit design; lead bonding; light emitting diodes; power semiconductor devices; printed circuits; radio networks; reliability; solders; CMOS integrated circuit design; LED; LTCC layers; antennas; electric engineering education; electronic module reliability; electronics packaging; power semiconductor devices; printed circuit board; radio network; sensors; solders; wire bonding;
Conference_Titel :
Electronics Technology (ISSE), 2010 33rd International Spring Seminar on
Conference_Location :
Warsaw
Print_ISBN :
978-1-4244-7849-1
DOI :
10.1109/ISSE.2010.5547286
