X-ray nanoCT of electronic components: Visualizing of internal 3D-structures with submicrometer resolution

High-resolution X-ray computed tomography (CT) allows the visualisation and failure analysis of the internal microstructure of small electronic devices - even if they have complicated 3D-structures where 2D X-ray microscopy would give unclear information. During the last decade, CT has progressed to higher resolution and faster reconstruction of the 3D-volume. Most recently it even allows a three-dimensional look into the inside of materials with submicron resolution. By means of nanofocus^reg tube technology, nanoCT^reg-systems are pushing forward into application fields that were exclusive to expensive synchrotron techniques. The new nanotom^reg of phoenix|X-ray is a very compact laboratory system specialised for the analysis of small samples with the exceptional submicron voxel-resolution down to 500 nm (0.5 microns). It is the first 180 kV nanofocus^reg computed tomography system in the world which is tailored specifically to the highest-resolution applications in the fields of electronics, micro mechanics or materials science. Therefore it is particularly suitable for nanoCT^reg-examination of electronic packages, sensors, actuators, complex micro electronic components with concealing parts such as capacitors or stacked dies and material samples of every type like synthetic materials, ceramics or composites. Any internal difference in material, density or porosity within a sample can be visualised and data like distances or pore volumes can be measured. By granting the user the ability to navigate the internal structure of an object slice-by-slice in a nondestructive manner, the nanotom^reg creates new possibilities for sample analysis per mouse click which have thus far been unreachable. NanoCT^reg widely expands the spectrum of detectable micro-structures and is ideal for the non-destructive inspection of compact but complex micro mechanic parts or electronic devices. The nanotom^{reg opens a new dimension of 3D-microanalysis and will partially replace destructive methods - saving costs and time per sample inspected.}