Title :
Study of interfacial reactions between Sn3.5Ag0.5Cu alloys and Cu substrate
Author :
Tsao, L.C. ; Chang, S.Y. ; Sun, W.H. ; Yen, S.F.
Author_Institution :
Dept. of Mater. Eng., Pingtung Univ. of Sci. & Technol., Pingtung, Taiwan
Abstract :
Interfacial reactions between Sn3.5Ag0.5Cu lead-free solders (SAC) and Cu were investigated during soldering reactions between liquid SAC and Cu substrate at 250, 260, 275, 300 and 325degC for various reaction times. Experimental results show that a scallop-shaped layer of Cu6Sn5 intermetallic compounds formed during the soldering. Kinetics analysis shows that the growth of such interfacial Cu6Sn5 intermetallic compounds is diffusion controlled with an activation energy of 65.69 kJ/mol. This interesting behavior of IMC dissolution is attributed to the relatively high solubility of Cu in liquid solders.
Keywords :
chemical interdiffusion; copper alloys; dissolving; reaction kinetics; silver alloys; soldering; solders; surface chemistry; tin alloys; Cu; Cu6Sn5; IMC dissolution; SnAgCu; activation energy; diffusion controlled compounds; interfacial reactions; intermetallic compounds; kinetics analysis; lead-free solders; liquid solders; scallop-shaped layer; soldering reactions; solubility; temperature 250 C; temperature 260 C; temperature 275 C; temperature 300 C; temperature 325 C; Copper alloys; Environmentally friendly manufacturing techniques; Furnaces; Intermetallic; Kinetic theory; Land surface temperature; Lead; Materials science and technology; Scanning electron microscopy; Soldering;
Conference_Titel :
Electronic Packaging Technology & High Density Packaging, 2009. ICEPT-HDP '09. International Conference on
Conference_Location :
Beijing
Print_ISBN :
978-1-4244-4658-2
Electronic_ISBN :
978-1-4244-4659-9
DOI :
10.1109/ICEPT.2009.5270549
