Title :
Committing of electronic modules by ball pins and their reliability
Author :
Svecová, Olga ; Kosína, Petr ; Sandera, Josef ; Adámek, Martin
Author_Institution :
Dept. of Microelectron., Brno Univ. of Technol., Brno, Czech Republic
Abstract :
The article states first results of reliability measurement of committing of electronic modules with printed circuit board by lead-free solder balls (SAC 305). In order to obtain experimental data, the test boards are periodically exposed to thermal load from -20°C to +100°C with 20 minutes dwell time on the maximum and minimum temperatures. Test samples are produced on alumina ceramics and/or four-layer LTCC ceramics. Test samples are soldered on to boards with various surface finishes: galvanic gold and HAL. The goal of the experiment is to determine the lifetime of ball solder joints in relation to varying thermal conductivity coefficient of base materials.
Keywords :
ball grid arrays; circuit reliability; copper alloys; printed circuits; silver alloys; solders; tin alloys; SnAgCu; alumina ceramics; ball pins; ball solder joints; electronic modules; four-layer LTCC ceramics; galvanic gold; lead-free solder balls; printed circuit board; reliability measurement; surface finishes; temperature -20 degC to 100 degC; thermal conductivity coefficient; time 20 min; Ceramics; Pins; Reliability; Soldering; Substrates; Temperature measurement;
Conference_Titel :
Electronics Technology (ISSE), 2010 33rd International Spring Seminar on
Conference_Location :
Warsaw
Print_ISBN :
978-1-4244-7849-1
Electronic_ISBN :
978-1-4244-7850-7
DOI :
10.1109/ISSE.2010.5547299
